
Amtech RMA-223-UV BGA Solder Paste 10ml
Application: for soldering and re-balling of computer and phone chips.
Material: the mixture of high-quality alloyed powder and resin paste flux, it can avoid the pale yellow residue.
RMA-223: high viscosity no-clean flux, reprocessing PCB, BGA, PGA, for soldering computer/phone chips.
RMA-223: a mixture of high-quality alloyed powder and resin paste flux, avoids pale yellow residue.