RL-404 Sn63 Pb37 138 ° C Medium Temperature Solder IC Paste
Alloy Composition: Sn63 Pb37 (63% Tin, 37% Lead)
Melting Point: 138°C
Excellent Wetting Properties
Extended shelf stability for prolonged usability
Medium Temperature Solder Paste is a high-performance soldering material designed for reliable electronic assembly. With a composition of Sn63 Pb37 and a melting point of 138°C, this paste ensures strong, durable solder joints and superior wetting properties. The no-clean flux formulation simplifies post-soldering cleaning, making it ideal for various applications in PCB assembly and repair. Perfect for professionals seeking consistent and dependable soldering results.